3D Solder Paste Inspection (SPI)
3D Solder Paste Inspection (SPI)
+17,000
Systems around the world
No.1
Market Position
350+
Systems in the UK
50%
Global Market Share
KOH YOUNG- 3D Solder Paste Inspection (SPI)
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"Best in class" 100% 3D SPI measurement and inspection technology. Offering unrivalled measurement accuracy and reliability, overcoming process bottlenecks and significantly improving yields
- Full range of demonstration equipment in our facility
- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction
- Full 3D foreign material inspection solution for the entire PCB
- High productivity through the highest accuracy
- Aspire 3, 8030-3 & 8030-2 available
Koh Young Process Improvement Software- KSMART
- Koh Young are taking the next steps in realising the Industry 4.0. A large step forward is due to the ability of the KSMART software to analyse real production data to optimise your manufacturing capabilities. KSMART is a modular software solution that allows you to unlock the 3D measurement data collected from your production to drive positive process improvement outcomes.
- Quantifiable measurement data to optimise your production processes through SPC
- Automatic closed loop feedback and feed forward capabilities for screen printer and pick and place
- Offline programming and debugging reducing machine downtime
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