Laser
Depaneling
LPKF- Laser depaneling for PCBAs
Stress-free separation of assembled rigid and flexible circuit boards
The reliability of the circuits is significantly improved, cleaning efforts are reduced or even eliminated with laser cutting; this enables considerable cost savings in depaneling. A new family of depaneling systems offers an unparalleled combination of performance, reliability and economy.
Process advantages through the use of laser technology?
Laser processing offers a number of advantages over conventional tools.
- The laser process is completely software-controlled. Different materials or cutting contours are easily incorporated by adjusting the processing parameters and laser paths. The changeover times when changing production are significantly reduced.
- There are no significant mechanical or thermal loads. Even sensitive substrates can be processed precisely in this way.
- The laser beam only needs a few µm as a cutting channel. This way more PCBs can be placed on one panel.
- The new LPKF CleanCut technology creates absolutely clean and distortion-free cutting channels - a new standard in depaneling
- Tensor Technology- LPKF's innovative tensor technology takes the laser depaneling process to the next level, significantly increasing the performance of the process in terms of speed and quality of cut.
