3D SOLDER PASTe INSPECTION (SPI) & 3D Automatic optical inspection (aoi)

Koh Young are the work leaders in Full 3D Solder Past Inspection (SPI) and Automated Optical Inspection (AOI). Using patented multi-frequency Moiré Technology, the Koh Young systems are capable of accurate quantitative measurement of solder paste deposits or components at full production speed. Enabling detection of faults which would be missed by conventional 2D, or 2D with selective 3D inspection machines. The measurement capability results in very low false call rate and can be used in closed loop mode to pick up trends in process window and correct errors before they become production problems.

Click the link here or see below for more information on 3D SPI and AOI: